The aluminum nitride ceramic powder we supply has high purity, small particle size, uniform distribution, high surface activity, low bulk density, good injection molding performance, good compatibility with semiconductor silicon, and good interface compatibility, which can improve the mechanical properties and thermal conductivity and dielectric properties of composite materials.
Main market applications
High thermal conductivity filler for thermal conductive paste and thermal conductive silicone grease;
High thermal conductivity filler for thermal grease, thermal conductive silica gel sheet and epoxy resin thermal conductive potting compound;
High thermal conductivity filler for thermal conductivity engineering plastics;
High thermal conductivity filler for packaging materials, high-temperature lubricants, adhesives, heat-dissipating paints and heat-dissipating inks;
Insulating and heat-conducting fillers for manufacturing integrated circuit substrates (MCPCB, FCCL) with high heat conductivity;
High thermal conductivity filler for thermal interface material (TIM);
Used for crucible metal melting, evaporation boats, ceramic knives, cutting tools and microwave dielectric materials;
Used for manufacturing aluminum nitride ceramic substrates with high thermal conductivity and various ceramic products;
Evaporation boat for conductive ceramics;
Used to synthesize high-quality LED phosphors.
